IS61SF12832-10B vs IS61VF25618A-7.5B2 feature comparison

IS61SF12832-10B Integrated Silicon Solution Inc

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IS61VF25618A-7.5B2 Integrated Silicon Solution Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-119 BGA, BGA119,7X17,50
Pin Count 119 119
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 7.5 ns
Additional Feature SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE FLOW-THROUGH ARCHITECTURE
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e0
Length 22 mm 22 mm
Memory Density 4194304 bit 4718592 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 32 18
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX32 256KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50 BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.41 mm 2.41 mm
Standby Current-Max 0.005 A 0.03 A
Standby Voltage-Min 3.14 V 2.38 V
Supply Current-Max 0.275 mA 0.155 mA
Supply Voltage-Max (Vsup) 3.63 V 2.75 V
Supply Voltage-Min (Vsup) 3.135 V 2.375 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 2
Clock Frequency-Max (fCLK) 117 MHz
Moisture Sensitivity Level 3

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