IS61SF12832-10B
vs
IS61VF25618A-7.5B2
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-119
BGA, BGA119,7X17,50
Pin Count
119
119
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
10 ns
7.5 ns
Additional Feature
SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE
FLOW-THROUGH ARCHITECTURE
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e0
e0
Length
22 mm
22 mm
Memory Density
4194304 bit
4718592 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
32
18
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
131072 words
262144 words
Number of Words Code
128000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX32
256KX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA119,7X17,50
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.41 mm
2.41 mm
Standby Current-Max
0.005 A
0.03 A
Standby Voltage-Min
3.14 V
2.38 V
Supply Current-Max
0.275 mA
0.155 mA
Supply Voltage-Max (Vsup)
3.63 V
2.75 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
2
Clock Frequency-Max (fCLK)
117 MHz
Moisture Sensitivity Level
3
Compare IS61SF12832-10B with alternatives
Compare IS61VF25618A-7.5B2 with alternatives