IS61QDP2B251236A-333M3L
vs
GS8182T36BD-167
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
LBGA, BGA165,11X15,40
LBGA,
Pin Count
165
165
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
28 Weeks
Access Time-Max
0.45 ns
0.5 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE, LATE WRITE
Clock Frequency-Max (fCLK)
333 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
17 mm
15 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
QDR SRAM
DDR II SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX36
512KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Standby Current-Max
0.29 A
Standby Voltage-Min
1.71 V
Supply Current-Max
1.2 mA
Supply Voltage-Max (Vsup)
1.89 V
1.9 V
Supply Voltage-Min (Vsup)
1.71 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
13 mm
Base Number Matches
1
1
Pbfree Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare IS61QDP2B251236A-333M3L with alternatives
Compare GS8182T36BD-167 with alternatives