IS61QDP2B21M36A-300B4I vs IBM0436A41QLAB-3P feature comparison

IS61QDP2B21M36A-300B4I Integrated Silicon Solution Inc

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IBM0436A41QLAB-3P IBM

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 BGA, BGA119,7X17,50
Pin Count 165 119
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 1.5 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 300 MHz
I/O Type SEPARATE COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B119
Length 15 mm 22 mm
Memory Density 37748736 bit 4718592 bit
Memory IC Type QDR SRAM STANDARD SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 1048576 words 131072 words
Number of Words Code 1000000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX36 128KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA165,11X15,40 BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 2.679 mm
Standby Current-Max 0.28 A 0.1 A
Standby Voltage-Min 1.7 V 3.14 V
Supply Current-Max 1.1 mA 0.47 mA
Supply Voltage-Max (Vsup) 1.89 V 3.63 V
Supply Voltage-Min (Vsup) 1.71 V 3.135 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

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