IS61QDB44M18-300M3L vs CY7C1513JV18-300BZXC feature comparison

IS61QDB44M18-300M3L Integrated Silicon Solution Inc

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CY7C1513JV18-300BZXC Rochester Electronics LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC ROCHESTER ELECTRONICS LLC
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Pin Count 165 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 300 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1
Length 17 mm 17 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type DDR SRAM QDR SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX18 4MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.4 mm 1.4 mm
Standby Voltage-Min 1.7 V
Supply Current-Max 0.8 mA
Supply Voltage-Max (Vsup) 1.89 V 1.9 V
Supply Voltage-Min (Vsup) 1.71 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 15 mm
Base Number Matches 1 2

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