IS61QDB22M36A-300B4LI
vs
CY7C1514V18-250BZC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
LBGA,
15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Pin Count
165
165
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
15 mm
17 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
QDR SRAM
QDR SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
2MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.89 V
1.9 V
Supply Voltage-Min (Vsup)
1.71 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
13 mm
15 mm
Base Number Matches
1
2
Rohs Code
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
SEPARATE
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Qualification Status
Not Qualified
Standby Voltage-Min
1.7 V
Terminal Finish
Tin/Lead (Sn/Pb)
Compare IS61QDB22M36A-300B4LI with alternatives
Compare CY7C1514V18-250BZC with alternatives