IS61QDB22M36A-300B4 vs GS8662R36BD-300I feature comparison

IS61QDB22M36A-300B4 Integrated Silicon Solution Inc

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GS8662R36BD-300I GSI Technology

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Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, LBGA, BGA165,11X15,40
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 15 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type QDR SRAM STANDARD SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36 2MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.89 V 1.9 V
Supply Voltage-Min (Vsup) 1.71 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 4 2
Pbfree Code No
Rohs Code No
Factory Lead Time 24 Weeks
Clock Frequency-Max (fCLK) 300 MHz
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Qualification Status Not Qualified
Standby Voltage-Min 1.7 V
Supply Current-Max 0.635 mA
Terminal Finish TIN LEAD

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