IS61QDB22M18-250M3I
vs
IS61QDB22M18C-250M3L
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SEIKO INSTRUMENTS USA INC
|
INTEGRATED SILICON SOLUTION INC
|
| Part Package Code |
BGA
|
|
| Package Description |
LBGA, BGA165,11X15,40
|
LBGA,
|
| Pin Count |
165
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
0.45 ns
|
0.45 ns
|
| Clock Frequency-Max (fCLK) |
250 MHz
|
|
| I/O Type |
SEPARATE
|
|
| JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
| Length |
17 mm
|
17 mm
|
| Memory Density |
37748736 bit
|
37748736 bit
|
| Memory IC Type |
DDR SRAM
|
QDR SRAM
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
165
|
165
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
2MX18
|
2MX18
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA165,11X15,40
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.4 mm
|
1.4 mm
|
| Standby Current-Max |
0.2 A
|
|
| Standby Voltage-Min |
1.71 V
|
|
| Supply Current-Max |
0.7 mA
|
|
| Supply Voltage-Max (Vsup) |
1.89 V
|
1.89 V
|
| Supply Voltage-Min (Vsup) |
1.71 V
|
1.71 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
15 mm
|
15 mm
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare IS61QDB22M18-250M3I with alternatives
Compare IS61QDB22M18C-250M3L with alternatives