IS61NVVP25672-250B vs GS8170LW72GC-300T feature comparison

IS61NVVP25672-250B Integrated Silicon Solution Inc

Buy Now Datasheet

GS8170LW72GC-300T GSI Technology

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-209 LBGA,
Pin Count 209 209
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 2.6 ns 1.8 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B209 R-PBGA-B209
JESD-609 Code e0 e1
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type ZBT SRAM STANDARD SRAM
Memory Width 72 72
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX72 256KX72
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.7 mm
Supply Voltage-Max (Vsup) 1.89 V 1.95 V
Supply Voltage-Min (Vsup) 1.71 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260

Compare IS61NVVP25672-250B with alternatives

Compare GS8170LW72GC-300T with alternatives