IS61NLP51236-200B3I vs IS61NLP51236B-200B3LA3 feature comparison

IS61NLP51236-200B3I Integrated Silicon Solution Inc

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IS61NLP51236B-200B3LA3 Integrated Silicon Solution Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Part Package Code BGA
Package Description TBGA, BGA165,11X15,40 TBGA,
Pin Count 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.1 ns 3 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0
Length 15 mm 15 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type ZBT SRAM STANDARD SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX36 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.075 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.475 mA
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 1 1

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Compare IS61NLP51236B-200B3LA3 with alternatives