IS61LV25616-10K
vs
CY7C1041DV33-10BVXIT
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
SOJ
|
|
| Package Description |
0.400 INCH, SOJ-44
|
6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48
|
| Pin Count |
44
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
10 ns
|
10 ns
|
| Additional Feature |
TTL COMPATIBLE INTERFACE LEVELS
|
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PDSO-J44
|
R-PBGA-B48
|
| JESD-609 Code |
e0
|
e1
|
| Length |
28.58 mm
|
8 mm
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
48
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
256KX16
|
256KX16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOJ
|
VFBGA
|
| Package Equivalence Code |
SOJ44,.44
|
SOJ44,.44
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.76 mm
|
1 mm
|
| Standby Current-Max |
0.01 A
|
0.01 A
|
| Standby Voltage-Min |
3.14 V
|
2 V
|
| Supply Current-Max |
0.26 mA
|
0.09 mA
|
| Supply Voltage-Max (Vsup) |
3.63 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
J BEND
|
BALL
|
| Terminal Pitch |
1.27 mm
|
0.75 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
10.16 mm
|
6 mm
|
| Base Number Matches |
2
|
1
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare IS61LV25616-10K with alternatives
Compare CY7C1041DV33-10BVXIT with alternatives