IS61LPS25636T-250TQ
vs
IBM04368ETLAC-30
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
IBM MICROELECTRONICS
Part Package Code
QFP
BGA
Package Description
TQFP-100
BGA, BGA119,7X17,50
Pin Count
100
119
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
2.6 ns
1.5 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
250 MHz
333 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQFP-G100
R-PBGA-B119
JESD-609 Code
e0
e0
Length
20 mm
22 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
100
119
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
Organization
256KX36
256KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
BGA
Package Equivalence Code
QFP100,.63X.87
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
2.683 mm
Standby Current-Max
0.03 A
0.12 A
Standby Voltage-Min
3.14 V
3.14 V
Supply Current-Max
0.14 mA
0.475 mA
Supply Voltage-Max (Vsup)
3.465 V
3.63 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
QUAD
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Compare IS61LPS25636T-250TQ with alternatives
Compare IBM04368ETLAC-30 with alternatives