IS61LPS12836A-200B2LI vs 71V35761S200BGGI8 feature comparison

IS61LPS12836A-200B2LI ABLIC Inc.

Buy Now Datasheet

71V35761S200BGGI8 Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer SEIKO INSTRUMENTS USA INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA PBGA
Package Description BGA,
Pin Count 119 119
Reach Compliance Code unknown unknown
Access Time-Max 3.1 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B119
Length 22 mm
Memory Density 4718592 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 119
Number of Words 131072 words
Number of Words Code 128000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128KX36
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max (Vsup) 3.465 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 14 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Manufacturer Package Code BGG119
ECCN Code EAR99
HTS Code 8542.32.00.41
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER

Compare IS61LPS12836A-200B2LI with alternatives

Compare 71V35761S200BGGI8 with alternatives