IS61LPS12836A-200B2LI
vs
71V35761S200BGGI8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
PBGA
Package Description
BGA, BGA119,7X17,50
Pin Count
119
119
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
12 Weeks
Access Time-Max
3.1 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
JESD-609 Code
e1
e1
Length
22 mm
Memory Density
4718592 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
36
Moisture Sensitivity Level
3
3
Number of Functions
1
Number of Terminals
119
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Seated Height-Max
2.41 mm
Standby Current-Max
0.075 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.21 mA
Supply Voltage-Max (Vsup)
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
10
Width
14 mm
Base Number Matches
2
1
Manufacturer Package Code
BGG119
Compare IS61LPS12836A-200B2LI with alternatives
Compare 71V35761S200BGGI8 with alternatives