IS61LF25672A-6.5B1
vs
GS816273AC-300I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
BGA, BGA209,11X19,40
LBGA,
Pin Count
209
209
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
1.7 ns
Additional Feature
PIPELINED ARCHITECTURE, FLOW-THROUGH
PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
JESD-609 Code
e0
Length
22 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
72
72
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX72
256KX72
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA209,11X19,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.95 mm
1.7 mm
Standby Current-Max
0.06 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.3 mA
Supply Voltage-Max (Vsup)
3.465 V
2 V
Supply Voltage-Min (Vsup)
3.135 V
1.6 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
220
Compare IS61LF25672A-6.5B1 with alternatives
Compare GS816273AC-300I with alternatives