IS61DDPB42M18A-500B4
vs
IS61DDP2B21M36C2-500B4LI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Package Description
LBGA,
LBGA,
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
15 mm
15 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
DDR SRAM
DDR SRAM
Memory Width
18
36
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
2097152 words
1048576 words
Number of Words Code
2000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX18
1MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.89 V
1.89 V
Supply Voltage-Min (Vsup)
1.71 V
1.71 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
4
1
Rohs Code
Additional Feature
PIPELINED ARCHITECTURE
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
10
Compare IS61DDPB42M18A-500B4 with alternatives
Compare IS61DDP2B21M36C2-500B4LI with alternatives