IS61DDP2B22M18A-400M3L
vs
KM736V795T-72T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
QFP
Package Description
LBGA,
LQFP,
Pin Count
165
100
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
28 Weeks
Access Time-Max
0.45 ns
JESD-30 Code
R-PBGA-B165
Length
17 mm
Memory Density
37748736 bit
Memory IC Type
DDR SRAM
Memory Width
18
Number of Functions
1
Number of Terminals
165
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
2MX18
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
1.89 V
Supply Voltage-Min (Vsup)
1.71 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15 mm
Base Number Matches
2
1
Compare IS61DDP2B22M18A-400M3L with alternatives
Compare KM736V795T-72T with alternatives