IS61DDB41M18A-333B4 vs CY7C1460V25-167BZC feature comparison

IS61DDB41M18A-333B4 Integrated Silicon Solution Inc

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CY7C1460V25-167BZC Cypress Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description LBGA, 15 X 17 MM, 1.20 MM HEIGHT, FBGA-165
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 3.5 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 17 mm
Memory Density 18874368 bit 37748736 bit
Memory IC Type DDR SRAM ZBT SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX18 1MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.89 V 2.625 V
Supply Voltage-Min (Vsup) 1.71 V 2.375 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 15 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
JESD-609 Code e0
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
Standby Voltage-Min 2.38 V
Terminal Finish TIN LEAD

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