IS61C88-15N
vs
EDI88130CS15L32M
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
MICROSEMI CORP
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
15 ns
|
15 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-PDIP-T24
|
R-CQCC-N32
|
JESD-609 Code |
e0
|
|
Memory Density |
65536 bit
|
1048576 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
4
|
8
|
Number of Terminals |
24
|
32
|
Number of Words |
16384 words
|
131072 words
|
Number of Words Code |
16000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
16KX4
|
128KX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
QCCN
|
Package Equivalence Code |
DIP24,.3
|
LCC32,.45X.55
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.006 A
|
0.015 A
|
Standby Voltage-Min |
4.5 V
|
4.5 V
|
Supply Current-Max |
0.19 mA
|
0.3 mA
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
QFJ
|
Package Description |
|
LCC-32
|
Pin Count |
|
32
|
Length |
|
13.97 mm
|
Number of Functions |
|
1
|
Seated Height-Max |
|
3.048 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Width |
|
11.43 mm
|
|
|
|
Compare IS61C88-15N with alternatives
Compare EDI88130CS15L32M with alternatives