IS61C64AL-10JLI-TR
vs
P4C164L-10P6MLF
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
PYRAMID SEMICONDUCTOR CORP
|
Part Package Code |
SOJ
|
DIP
|
Package Description |
SOJ,
|
0.600 INCH, ROHS COMPLIANT, PLASTIC, DIP-28
|
Pin Count |
28
|
28
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Factory Lead Time |
8 Weeks
|
|
Samacsys Manufacturer |
Integrated Silicon Solution Inc.
|
|
Access Time-Max |
10 ns
|
10 ns
|
JESD-30 Code |
R-PDSO-J28
|
R-PDIP-T28
|
JESD-609 Code |
e3
|
e3
|
Length |
18.415 mm
|
36.322 mm
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Number of Words |
8192 words
|
8192 words
|
Number of Words Code |
8000
|
8000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Organization |
8KX8
|
8KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOJ
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
3.56 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
15.24 mm
|
Base Number Matches |
1
|
1
|
Screening Level |
|
MIL-STD-883
|
|
|
|
Compare IS61C64AL-10JLI-TR with alternatives
Compare P4C164L-10P6MLF with alternatives