IS49NLS96400-18BL vs GS4576C09GM-18I feature comparison

IS49NLS96400-18BL Integrated Silicon Solution Inc

Buy Now Datasheet

GS4576C09GM-18I GSI Technology

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC GSI TECHNOLOGY
Part Package Code BGA
Package Description TBGA, LBGA,
Pin Count 144
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 1.875 ns
Additional Feature AUTO REFRESH AUTO REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
Length 18.5 mm 18.5 mm
Memory Density 603979776 bit 603979776 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 9 9
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 95 °C
Operating Temperature-Min -40 °C
Organization 64MX9 64MX9
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, LOW PROFILE
Seated Height-Max 1.2 mm 1.25 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 11 mm
Base Number Matches 1 1
Rohs Code Yes
Date Of Intro 2017-10-03
Samacsys Manufacturer GSI TECHNOLOGY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare IS49NLS96400-18BL with alternatives

Compare GS4576C09GM-18I with alternatives