IS49NLS96400-18BL
vs
GS4576C09GM-18I
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
GSI TECHNOLOGY
|
Part Package Code |
BGA
|
|
Package Description |
TBGA,
|
LBGA,
|
Pin Count |
144
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.32
|
8542.32.00.32
|
Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
Access Time-Max |
1.875 ns
|
|
Additional Feature |
AUTO REFRESH
|
AUTO REFRESH
|
JESD-30 Code |
R-PBGA-B144
|
R-PBGA-B144
|
Length |
18.5 mm
|
18.5 mm
|
Memory Density |
603979776 bit
|
603979776 bit
|
Memory IC Type |
DDR DRAM
|
DDR DRAM
|
Memory Width |
9
|
9
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
144
|
144
|
Number of Words |
67108864 words
|
67108864 words
|
Number of Words Code |
64000000
|
64000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
95 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
64MX9
|
64MX9
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TBGA
|
LBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, LOW PROFILE
|
Seated Height-Max |
1.2 mm
|
1.25 mm
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
11 mm
|
11 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Date Of Intro |
|
2017-10-03
|
Samacsys Manufacturer |
|
GSI TECHNOLOGY
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare IS49NLS96400-18BL with alternatives
Compare GS4576C09GM-18I with alternatives