IS49NLS18160-33BLI
vs
IS49NLS18160-18BLI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
TBGA, BGA144,12X18,40/32
TBGA,
Pin Count
144
144
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
3.3 ns
1.875 ns
Additional Feature
AUTO REFRESH
AUTO REFRESH
Clock Frequency-Max (fCLK)
300 MHz
I/O Type
SEPARATE
Interleaved Burst Length
2,4,8
JESD-30 Code
R-PBGA-B144
R-PBGA-B144
Length
18.5 mm
18.5 mm
Memory Density
301989888 bit
301989888 bit
Memory IC Type
DDR1 DRAM
DDR DRAM
Memory Width
18
18
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX18
16MX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Equivalence Code
BGA144,12X18,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.048 A
Supply Current-Max
0.819 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
11 mm
11 mm
Base Number Matches
1
1
Compare IS49NLS18160-33BLI with alternatives
Compare IS49NLS18160-18BLI with alternatives