IS49NLC93200-5BI
vs
IS49NLC93200-5BLI
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
INTEGRATED SILICON SOLUTION INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
11 X 18.50 MM, FBGA-144
|
11 X 18.50 MM, LEAD FREE, FBGA-144
|
Pin Count |
144
|
144
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.28
|
8542.32.00.28
|
Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
Access Time-Max |
5 ns
|
5 ns
|
Additional Feature |
AUTO REFRESH
|
AUTO REFRESH
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-PBGA-B144
|
R-PBGA-B144
|
Length |
18.5 mm
|
18.5 mm
|
Memory Density |
301989888 bit
|
301989888 bit
|
Memory IC Type |
DDR DRAM
|
DDR DRAM
|
Memory Width |
9
|
9
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
144
|
144
|
Number of Words |
33554432 words
|
33554432 words
|
Number of Words Code |
32000000
|
32000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
32MX9
|
32MX9
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TBGA
|
TBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, THIN PROFILE
|
Refresh Cycles |
8192
|
8192
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Sequential Burst Length |
2,4,8
|
2,4,8
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
11 mm
|
11 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IS49NLC93200-5BI with alternatives
Compare IS49NLC93200-5BLI with alternatives