IS49NLC36800-25EWBLI
vs
MT49H8M36HT-5
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
MICRON TECHNOLOGY INC
Package Description
TBGA,
TBGA, BGA144,12X18,40/32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Factory Lead Time
12 Weeks
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Clock Frequency-Max (fCLK)
400 MHz
200 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B144
R-PBGA-B144
Length
18.5 mm
18.5 mm
Memory Density
301989888 bit
301989888 bit
Memory IC Type
DDR1 DRAM
DDR DRAM
Memory Width
36
36
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
8MX36
8MX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TBGA
Package Equivalence Code
BGA144,12X18,40/32
BGA144,12X18,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
Sequential Burst Length
2,4,8
2,4,8
Standby Current-Max
0.053 A
Supply Current-Max
1.105 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
11 mm
11 mm
Base Number Matches
1
2
Part Package Code
BGA
Pin Count
144
Access Time-Max
0.5 ns
Additional Feature
AUTO REFRESH
JESD-609 Code
e1
Qualification Status
Not Qualified
Terminal Finish
TIN SILVER COPPER
Compare IS49NLC36800-25EWBLI with alternatives
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