IS49NLC18160-25BLI vs MT49H16M18SJ-25:B feature comparison

IS49NLC18160-25BLI Integrated Silicon Solution Inc

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MT49H16M18SJ-25:B Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description TBGA, BGA144,12X18,40/32 TBGA,
Pin Count 144
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 2.5 ns
Additional Feature AUTO REFRESH AUTO REFRESH
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B144 R-PBGA-B144
Length 18.5 mm 18.5 mm
Memory Density 301989888 bit 301989888 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 16MX18 16MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA144,12X18,40/32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Sequential Burst Length 2,4,8
Supply Current-Max 0.97 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 11 mm
Base Number Matches 1 1
Factory Lead Time 12 Weeks
Samacsys Manufacturer Micron
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare IS49NLC18160-25BLI with alternatives

Compare MT49H16M18SJ-25:B with alternatives