IS46TR16128A-187FBLA2
vs
H5TQ2G63BFR-TEJ
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
SK HYNIX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA, BGA96,9X16,32
|
TFBGA, BGA96,9X16,32
|
Pin Count |
96
|
96
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.36
|
8542.32.00.36
|
Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
Access Time-Max |
13.125 ns
|
0.18 ns
|
Additional Feature |
AUTO SELF REFRESH MODE, ALSO OPERATES AT 1.35 V NOMINAL SUPPLY
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK) |
533 MHz
|
1066 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
4,8
|
4,8
|
JESD-30 Code |
R-PBGA-B96
|
R-PBGA-B96
|
Length |
13 mm
|
13 mm
|
Memory Density |
2147483648 bit
|
2147483648 bit
|
Memory IC Type |
DDR3 DRAM
|
DDR3 DRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
96
|
96
|
Number of Words |
134217728 words
|
134217728 words
|
Number of Words Code |
128000000
|
128000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
105 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
128MX16
|
128MX16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA96,9X16,32
|
BGA96,9X16,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
8192
|
8192
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Sequential Burst Length |
4,8
|
4,8
|
Standby Current-Max |
0.02 A
|
0.012 A
|
Supply Current-Max |
0.271 mA
|
0.285 mA
|
Supply Voltage-Max (Vsup) |
1.575 V
|
1.575 V
|
Supply Voltage-Min (Vsup) |
1.425 V
|
1.425 V
|
Supply Voltage-Nom (Vsup) |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
9 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e1
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare IS46TR16128A-187FBLA2 with alternatives
Compare H5TQ2G63BFR-TEJ with alternatives