IS42S32200E-7BL vs K4S64323LH-FG1L0 feature comparison

IS42S32200E-7BL ABLIC Inc.

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K4S64323LH-FG1L0 Samsung Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer SEIKO INSTRUMENTS USA INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description TFBGA, LFBGA,
Pin Count 90 90
Reach Compliance Code unknown compliant
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 5.5 ns 7 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B90 R-PBGA-B90
Length 13 mm 13 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
Memory Width 32 32
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 90 90
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -25 °C
Organization 2MX32 2MX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 2.7 V
Supply Voltage-Min (Vsup) 3 V 2.3 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 2 1
Rohs Code No
ECCN Code EAR99
HTS Code 8542.32.00.02
Peak Reflow Temperature (Cel) 240
Self Refresh YES
Time@Peak Reflow Temperature-Max (s) 30

Compare IS42S32200E-7BL with alternatives

Compare K4S64323LH-FG1L0 with alternatives