IS32WV16100A-70M
vs
UPD4616112F9-BC90-BC2-A
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
NEC ELECTRONICS CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA,
|
6 X 8 MM, FBGA-48
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
70 ns
|
90 ns
|
| JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
| JESD-609 Code |
e0
|
e1
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
PSEUDO STATIC RAM
|
APPLICATION SPECIFIC SRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| Organization |
1MX16
|
1MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
2.2 V
|
3 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
2.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
1
|
1
|
| Length |
|
8 mm
|
| Seated Height-Max |
|
1.04 mm
|
| Terminal Pitch |
|
0.75 mm
|
| Width |
|
6 mm
|
|
|
|
Compare IS32WV16100A-70M with alternatives
Compare UPD4616112F9-BC90-BC2-A with alternatives