IS25LQ512B-JWLE1 vs IS25LQ512B-JDLA1 feature comparison

IS25LQ512B-JWLE1 Integrated Silicon Solution Inc

Buy Now Datasheet

IS25LQ512B-JDLA1 Integrated Silicon Solution Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description DIE, TSSOP,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code X-XUUC-N R-PDSO-G8
Memory Density 524288 bit 524288 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX8 64KX8
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE TSSOP
Package Equivalence Code DIE OR CHIP TSSOP8,.25
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programming Voltage 3 V 3 V
Serial Bus Type QSPI QSPI
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Type NOR TYPE NOR TYPE
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1
Length 4.4 mm
Number of Terminals 8
Screening Level AEC-Q100
Seated Height-Max 1.2 mm
Terminal Pitch 0.65 mm
Width 3 mm

Compare IS25LQ512B-JWLE1 with alternatives

Compare IS25LQ512B-JDLA1 with alternatives