IS25LP032D-RHLE
vs
W25X32VSSIZ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
WINBOND ELECTRONICS CORP
Package Description
TBGA,
SOP, SOP8,.3
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Date Of Intro
2017-01-06
Alternate Memory Width
1
Clock Frequency-Max (fCLK)
133 MHz
33 MHz
JESD-30 Code
R-PBGA-B24
S-PDSO-G8
JESD-609 Code
e1
Length
8 mm
5.27 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
8
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX8
4MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
SOP
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Programming Voltage
3 V
3 V
Seated Height-Max
1.2 mm
2.16 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
6 mm
5.27 mm
Base Number Matches
1
2
Part Package Code
SOIC
Pin Count
8
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
Package Equivalence Code
SOP8,.3
Qualification Status
Not Qualified
Serial Bus Type
SPI
Standby Current-Max
0.00001 A
Supply Current-Max
0.025 mA
Type
NOR TYPE
Write Protection
HARDWARE/SOFTWARE
Compare IS25LP032D-RHLE with alternatives
Compare W25X32VSSIZ with alternatives