IS25LP032D-JKLA1 vs IS25LP032D-RGLA3 feature comparison

IS25LP032D-JKLA1 Integrated Silicon Solution Inc

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IS25LP032D-RGLA3 Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description HVSON, TBGA,
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Date Of Intro 2017-01-06 2017-01-06
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
JESD-30 Code R-PDSO-N8 R-PBGA-B24
Length 6 mm 8 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 24
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX8 4MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 0.8 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form NO LEAD BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position DUAL BOTTOM
Width 5 mm 6 mm
Base Number Matches 1 1
Rohs Code Yes
Alternate Memory Width 1
JESD-609 Code e1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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