IS25LP016D-RMLA2
vs
IS25LP016D-RHLA1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Package Description
SOP,
TBGA,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
133 MHz
133 MHz
Data Retention Time-Min
20
20
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-G16
R-PBGA-B24
Length
10.31 mm
8 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
16
24
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX8
2MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TBGA
Package Equivalence Code
SOP16,.4
BGA24,5X5,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
GRID ARRAY, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
2.65 mm
1.2 mm
Serial Bus Type
QSPI
QSPI
Standby Current-Max
0.000015 A
0.00001 A
Supply Current-Max
0.013 mA
0.013 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
DUAL
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
7.49 mm
6 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
1
1
Compare IS25LP016D-RMLA2 with alternatives
Compare IS25LP016D-RHLA1 with alternatives