IS25LP016D-RGLA3
vs
W25Q16DVSNJP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
WINBOND ELECTRONICS CORP
Package Description
TBGA,
SOP, SOP8,.25
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
133 MHz
80 MHz
Data Retention Time-Min
20
20
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-PBGA-B24
R-PDSO-G8
Length
8 mm
4.9 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
8
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX8
2MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
SOP
Package Equivalence Code
BGA24,4X6,40
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Screening Level
AEC-Q100
Seated Height-Max
1.2 mm
1.75 mm
Serial Bus Type
QSPI
SPI
Standby Current-Max
0.00003 A
0.000025 A
Supply Current-Max
0.013 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
DUAL
Type
NOR TYPE
NOR TYPE
Width
6 mm
3.9 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
8
JESD-609 Code
e3
Qualification Status
Not Qualified
Terminal Finish
MATTE TIN
Compare IS25LP016D-RGLA3 with alternatives
Compare W25Q16DVSNJP with alternatives