IRFP9240
vs
IRFP9242
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
ROCHESTER ELECTRONICS LLC
|
Package Description |
FLANGE MOUNT, R-PSFM-T3
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.29.00.95
|
|
Avalanche Energy Rating (Eas) |
790 mJ
|
790 mJ
|
Case Connection |
DRAIN
|
DRAIN
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
200 V
|
200 V
|
Drain Current-Max (ID) |
12 A
|
10 A
|
Drain-source On Resistance-Max |
0.5 Ω
|
0.7 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-247
|
TO-247
|
JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
Power Dissipation Ambient-Max |
150 W
|
|
Power Dissipation-Max (Abs) |
150 W
|
|
Pulsed Drain Current-Max (IDM) |
48 A
|
40 A
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
SINGLE
|
SINGLE
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Turn-off Time-Max (toff) |
134 ns
|
|
Turn-on Time-Max (ton) |
90 ns
|
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Moisture Sensitivity Level |
|
NOT SPECIFIED
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare IRFP9240 with alternatives
Compare IRFP9242 with alternatives