IRFN9240
vs
STFM9240VP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TT ELECTRONICS PLC
MICROSEMI CORP
Package Description
CHIP CARRIER, R-CBCC-N3
FLANGE MOUNT, S-MSFM-P3
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Avalanche Energy Rating (Eas)
500 mJ
Case Connection
DRAIN
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE
DS Breakdown Voltage-Min
200 V
200 V
Drain Current-Max (ID)
11 A
11 A
Drain-source On Resistance-Max
0.5 Ω
0.51 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code
TO-276AB
TO-254AA
JESD-30 Code
R-CBCC-N3
S-MSFM-P3
Number of Elements
1
1
Number of Terminals
3
3
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
150 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
METAL
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
FLANGE MOUNT
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity/Channel Type
P-CHANNEL
P-CHANNEL
Pulsed Drain Current-Max (IDM)
44 A
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
NO
Terminal Form
NO LEAD
PIN/PEG
Terminal Position
BOTTOM
SINGLE
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Transistor Application
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
3
1
Part Package Code
TO-254AA
Pin Count
3
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare IRFN9240 with alternatives
Compare STFM9240VP with alternatives