IRFN9240
vs
STFM9240VP
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TT ELECTRONICS PLC
|
MICROSEMI CORP
|
Package Description |
CHIP CARRIER, R-CBCC-N3
|
FLANGE MOUNT, S-MSFM-P3
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Avalanche Energy Rating (Eas) |
500 mJ
|
|
Case Connection |
DRAIN
|
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE
|
DS Breakdown Voltage-Min |
200 V
|
200 V
|
Drain Current-Max (ID) |
11 A
|
11 A
|
Drain-source On Resistance-Max |
0.5 Ω
|
0.51 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-276AB
|
TO-254AA
|
JESD-30 Code |
R-CBCC-N3
|
S-MSFM-P3
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
METAL
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
Pulsed Drain Current-Max (IDM) |
44 A
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Terminal Form |
NO LEAD
|
PIN/PEG
|
Terminal Position |
BOTTOM
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Transistor Application |
SWITCHING
|
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
3
|
1
|
Part Package Code |
|
TO-254AA
|
Pin Count |
|
3
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare IRFN9240 with alternatives
Compare STFM9240VP with alternatives