IRFN140-JQR-BR4
vs
2N7218
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
TT ELECTRONICS PLC
|
OMNIREL CORP
|
Package Description |
CHIP CARRIER, R-XBCC-N3
|
HERMETIC SEALED, TO-254AA, 3 PIN
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Avalanche Energy Rating (Eas) |
250 mJ
|
|
Case Connection |
DRAIN
|
ISOLATED
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
100 V
|
100 V
|
Drain Current-Max (ID) |
28 A
|
20 A
|
Drain-source On Resistance-Max |
0.125 Ω
|
0.125 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-276AB
|
TO-254AA
|
JESD-30 Code |
R-XBCC-N3
|
S-MSFM-P3
|
JESD-609 Code |
e4
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
UNSPECIFIED
|
METAL
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLANGE MOUNT
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Pulsed Drain Current-Max (IDM) |
112 A
|
112 A
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
GOLD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
NO LEAD
|
PIN/PEG
|
Terminal Position |
BOTTOM
|
SINGLE
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
2
|
4
|
Additional Feature |
|
HIGH RELIABILITY
|
Power Dissipation-Max (Abs) |
|
125 W
|
|
|
|
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