IRFF430
vs
IRFF430-JQR-B
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
GENERAL ELECTRIC SOLID STATE
|
TT ELECTRONICS PLC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Base Number Matches |
13
|
2
|
| Rohs Code |
|
No
|
| Package Description |
|
CYLINDRICAL, O-MBCY-W3
|
| Avalanche Energy Rating (Eas) |
|
0.35 mJ
|
| Configuration |
|
SINGLE
|
| DS Breakdown Voltage-Min |
|
500 V
|
| Drain Current-Max (ID) |
|
2.5 A
|
| Drain-source On Resistance-Max |
|
1.725 Ω
|
| FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
| JEDEC-95 Code |
|
TO-205AF
|
| JESD-30 Code |
|
O-MBCY-W3
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
3
|
| Operating Mode |
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
|
150 °C
|
| Package Body Material |
|
METAL
|
| Package Shape |
|
ROUND
|
| Package Style |
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Polarity/Channel Type |
|
N-CHANNEL
|
| Pulsed Drain Current-Max (IDM) |
|
11 A
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
NO
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Transistor Element Material |
|
SILICON
|
|
|
|
Compare IRFF430-JQR-B with alternatives