IRF9140
vs
IRF5NJ9540
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TT ELECTRONICS PLC
|
INFINEON TECHNOLOGIES AG
|
Package Description |
HERMETIC SEALED, METAL, 3 PIN
|
CHIP CARRIER, R-XBCC-N3
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
Avalanche Energy Rating (Eas) |
500 mJ
|
260 mJ
|
Case Connection |
DRAIN
|
DRAIN
|
Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
100 V
|
100 V
|
Drain Current-Max (ID) |
18 A
|
18 A
|
Drain-source On Resistance-Max |
0.23 Ω
|
0.117 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-3
|
|
JESD-30 Code |
O-MBFM-P2
|
R-XBCC-N3
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
METAL
|
UNSPECIFIED
|
Package Shape |
ROUND
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
Pulsed Drain Current-Max (IDM) |
72 A
|
72 A
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
YES
|
Terminal Form |
PIN/PEG
|
NO LEAD
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
10
|
5
|
Samacsys Manufacturer |
|
Infineon
|
JESD-609 Code |
|
e0
|
Operating Temperature-Min |
|
-55 °C
|
Power Dissipation-Max (Abs) |
|
75 W
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Turn-off Time-Max (toff) |
|
171 ns
|
Turn-on Time-Max (ton) |
|
164 ns
|
|
|
|
Compare IRF9140 with alternatives
Compare IRF5NJ9540 with alternatives