IP4777CZ38/V
vs
IP4777CZ38
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
4.40 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-153, SOT510-1, TSSOP-38
|
4.40 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-153, SOT510-1, TSSOP-38
|
| Pin Count |
38
|
38
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO REQUIRES SUPPLY FROM 4.5 TO 5.5
|
ALSO REQUIRES SUPPLY FROM 4.5 TO 5.5
|
| Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
| JESD-30 Code |
R-PDSO-G38
|
R-PDSO-G38
|
| JESD-609 Code |
e4
|
e4
|
| Length |
9.7 mm
|
9.7 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
38
|
38
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP38,.25,20
|
TSSOP38,.25,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
2
|
5
|
|
|
|
Compare IP4777CZ38/V with alternatives
Compare IP4777CZ38 with alternatives