IMRD-67142L-55SHXXX:RD
vs
71321SA55PF9
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code
unknown
compliant
Access Time-Max
55 ns
55 ns
JESD-30 Code
S-CQFP-F64
S-PQFP-G64
Memory Density
16384 bit
16384 bit
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
2
Number of Terminals
64
64
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2KX8
2KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
2 V
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
FLAT
GULL WING
Terminal Position
QUAD
QUAD
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
QFP
Package Description
14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
Pin Count
64
ECCN Code
EAR99
HTS Code
8542.32.00.41
Additional Feature
INTERRUPT FLAG; AUTOMATIC POWER-DOWN
JESD-609 Code
e0
Length
14 mm
Moisture Sensitivity Level
3
Package Code
LQFP
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.6 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
0.8 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
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