IMC1812EB470K
vs
IMC1812BN470K
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
VISHAY INTERTECHNOLOGY INC
|
Package Description |
CHIP, 1812
|
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
22 Weeks
|
22 Weeks
|
Case/Size Code |
1812
|
1812
|
Construction |
Molded Chip
|
Molded Chip
|
Core Material |
IRON
|
IRON
|
DC Resistance |
5 Ω
|
5 Ω
|
Inductance-Nom (L) |
47 µH
|
47 µH
|
Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
JESD-609 Code |
e3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
3.2 mm
|
3.2 mm
|
Package Length |
4.5 mm
|
4.5 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
3.2 mm
|
3.2 mm
|
Packing Method |
Bulk
|
Bulk
|
Quality Factor-Min (at L-nom) |
50
|
50
|
Rated Current-Max |
0.14 A
|
0.14 A
|
Self Resonance Frequency |
10 MHz
|
10 MHz
|
Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
Shielded |
NO
|
NO
|
Special Feature |
Q MEASURED AT 2.52MHZ
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Placement |
DUAL ENDED
|
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Test Frequency |
2.52 MHz
|
|
Tolerance |
10%
|
10%
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IMC1812EB470K with alternatives
Compare IMC1812BN470K with alternatives