IL611-1E
vs
HCPL-7851300
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NVE CORP
|
AVAGO TECHNOLOGIES INC
|
Part Package Code |
MSOP
|
SOIC
|
Package Description |
TSSOP,
|
SOL,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.33.00.01
|
|
Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
Common Mode Voltage-Max |
400 V
|
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-L8
|
JESD-609 Code |
e3
|
|
Length |
3 mm
|
9.655 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
2
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOL
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
5.57 mm
|
Supply Voltage Limit-Max |
7 V
|
5.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
Tin (Sn)
|
|
Terminal Form |
GULL WING
|
L BEND
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
3 mm
|
7.366 mm
|
Base Number Matches |
1
|
3
|
Pbfree Code |
|
Yes
|
Bandwidth (3dB)-Nom |
|
100 MHz
|
Voltage Gain-Max |
|
8.4
|
Voltage Gain-Min |
|
7.6
|
|
|
|
Compare IL611-1E with alternatives
Compare HCPL-7851300 with alternatives