IL1P-67201L-55
vs
AM3P-67201AV-25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEMIC SEMICONDUCTORS
TEMIC SEMICONDUCTORS
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
55 ns
25 ns
Clock Frequency-Max (fCLK)
14.29 MHz
25.57 MHz
Cycle Time
70 ns
35 ns
JESD-30 Code
R-XDIP-T28
R-PDIP-T28
JESD-609 Code
e0
e0
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512X9
512X9
Output Enable
NO
NO
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.00004 A
Supply Current-Max
0.07 mA
0.14 mA
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Package Description
0.300 INCH, PLASTIC, DIP-28
Output Characteristics
3-STATE
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V