IDTQS74FCT2573TQ
vs
QS54FCT2573TDB
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
QUALITY SEMICONDUCTOR INC
Part Package Code
QSOP
Package Description
SSOP, SOP20,.4
DIP, DIP20,.3
Pin Count
20
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
FCT
FCT
JESD-30 Code
R-PDSO-G20
R-CDIP-T20
JESD-609 Code
e0
e0
Length
8.6868 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.012 A
0.012 A
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE WITH SERIES RESISTOR
3-STATE WITH SERIES RESISTOR
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SSOP
DIP
Package Equivalence Code
SOP20,.4
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
225
Prop. Delay@Nom-Sup
8 ns
8.5 ns
Propagation Delay (tpd)
13 ns
14 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7272 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.635 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
3.937 mm
Base Number Matches
2
1
Additional Feature
BROADSIDE VERSION OF 2373
Screening Level
38535Q/M;38534H;883B
Compare IDTQS74FCT2573TQ with alternatives
Compare QS54FCT2573TDB with alternatives