IDTQS3VH245PA
vs
SN74CBTLV3245AZQNR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Part Package Code
TSSOP
BGA
Package Description
TSSOP, TSSOP20,.25
GREEN, PLASTIC, VFBGA-20
Pin Count
20
20
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
CB3Q/3VH/3C/2B
CBTLV/3B
JESD-30 Code
R-PDSO-G20
R-PBGA-B20
JESD-609 Code
e0
e1
Length
6.5 mm
4 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
1
Number of Bits
8
8
Number of Functions
1
8
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
VFBGA
Package Equivalence Code
TSSOP20,.25
BGA20,4X5,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
240
260
Propagation Delay (tpd)
0.2 ns
0.25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Width
4.4 mm
3 mm
Base Number Matches
1
1
Date Of Intro
1993-04-01
Control Type
ENABLE LOW
Count Direction
BIDIRECTIONAL
Load Capacitance (CL)
50 pF
Packing Method
TR
Power Supply Current-Max (ICC)
0.01 mA
Prop. Delay@Nom-Sup
0.25 ns
Compare IDTQS3VH245PA with alternatives
Compare SN74CBTLV3245AZQNR with alternatives