IDTQS3257Q
vs
IDTQS3VH257QG8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
SOIC
SOIC
Package Description
SSOP, SSOP16,.25
GREEN, QSOP-16
Pin Count
16
16
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
3257
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
e3
Length
4.9 mm
4.9 mm
Logic IC Type
BUS EXCHANGER
BUS EXCHANGER
Moisture Sensitivity Level
1
1
Number of Bits
4
4
Number of Functions
1
1
Number of Ports
3
3
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Equivalence Code
SSOP16,.25
SSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
260
Propagation Delay (tpd)
0.25 ns
0.2 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.25 V
3.6 V
Supply Voltage-Min (Vsup)
4.75 V
2.3 V
Supply Voltage-Nom (Vsup)
5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
30
Width
3.9116 mm
3.9116 mm
Base Number Matches
1
2
Pbfree Code
ECCN Code
EAR99
Compare IDTQS3257Q with alternatives
Compare IDTQS3VH257QG8 with alternatives