IDTQS3251S1
vs
54F157A/B2A
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
PHILIPS COMPONENTS
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
ENABLE LOW
|
|
| Count Direction |
BIDIRECTIONAL
|
|
| Family |
CBT/FST/QS/5C/B
|
F/FAST
|
| JESD-30 Code |
R-PDSO-G16
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS EXCHANGER
|
MULTIPLEXER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
4
|
| Number of Inputs |
1
|
2
|
| Number of Outputs |
8
|
1
|
| Number of Ports |
9
|
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Packing Method |
TUBE; TRAY
|
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Prop. Delay@Nom-Sup |
0.25 ns
|
|
| Propagation Delay (tpd) |
0.25 ns
|
9.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
3
|
| Package Code |
|
QCCN
|
| Package Equivalence Code |
|
LCC20,.35SQ
|
| Package Style |
|
CHIP CARRIER
|
| Power Supply Current-Max (ICC) |
|
23 mA
|
|
|
|
Compare IDTQS3251S1 with alternatives
Compare 54F157A/B2A with alternatives