IDTCSPUA877ANLG vs CSPU877BVG8 feature comparison

IDTCSPUA877ANLG Integrated Device Technology Inc

Buy Now Datasheet

CSPU877BVG8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFN CABGA
Package Description GREEN, PLASTIC, VFQFPN-40 GREEN, VFBGA-52
Pin Count 40 52
Manufacturer Package Code VFQFPN BVG52
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family CSPUA877 877
Input Conditioning DIFFERENTIAL DIFFERENTIAL
JESD-30 Code S-PQCC-N40 R-XBGA-B52
JESD-609 Code e3 e1
Length 6 mm 7 mm
Logic IC Type PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
Max I(ol) 0.009 A 0.009 A
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 40 52
Number of True Outputs 10 10
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code HVQCCN VFBGA
Package Equivalence Code LCC40,.24SQ,20 BGA52,6X10,25
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.04 ns 0.04 ns
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed TIN SILVER COPPER
Terminal Form NO LEAD BALL
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 6 mm 4.5 mm
fmax-Min 410 MHz 340 MHz
Base Number Matches 2 2
Output Characteristics 3-STATE
Technology CMOS

Compare IDTCSPUA877ANLG with alternatives

Compare CSPU877BVG8 with alternatives