IDTCSPU877DNLG
vs
CSPU877ANL8
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
DFN
|
|
| Package Description |
HVQCCN, LCC40,.24SQ,20
|
QCCN, LCC40,.24SQ,20
|
| Pin Count |
40
|
|
| Manufacturer Package Code |
MLF
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
877
|
|
| Input Conditioning |
DIFFERENTIAL
|
|
| JESD-30 Code |
S-PQCC-N40
|
S-PQCC-N40
|
| JESD-609 Code |
e3
|
e0
|
| Length |
6 mm
|
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
|
| Max I(ol) |
0.009 A
|
0.009 A
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
40
|
40
|
| Number of True Outputs |
10
|
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
QCCN
|
| Package Equivalence Code |
LCC40,.24SQ,20
|
LCC40,.24SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.04 ns
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
6 mm
|
|
| fmax-Min |
340 MHz
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare IDTCSPU877DNLG with alternatives
Compare CSPU877ANL8 with alternatives