IDTCSPT857CNL8
vs
9DB108YFT
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
QFN
|
SSOP
|
Package Description |
HVQCCN, LCC40,.24SQ,20
|
SSOP,
|
Pin Count |
40
|
48
|
Manufacturer Package Code |
VFQFPN
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
857
|
9DB
|
Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
JESD-30 Code |
S-XQCC-N40
|
R-PDSO-G48
|
JESD-609 Code |
e0
|
e0
|
Length |
6 mm
|
15.875 mm
|
Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
Max I(ol) |
0.012 A
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
40
|
48
|
Number of True Outputs |
10
|
8
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
SSOP
|
Package Equivalence Code |
LCC40,.24SQ,20
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
240
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.075 ns
|
0.05 ns
|
Seated Height-Max |
1 mm
|
2.8 mm
|
Supply Voltage-Max (Vsup) |
2.7 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.635 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
6 mm
|
7.5 mm
|
fmax-Min |
220 MHz
|
220 MHz
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
|
|
|
Compare IDTCSPT857CNL8 with alternatives
Compare 9DB108YFT with alternatives