IDT82V2088BBG
vs
IDT82V2088BB
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
PLASTIC, BGA-208
|
PLASTIC, BGA-208
|
Pin Count |
208
|
208
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B208
|
S-PBGA-B208
|
JESD-609 Code |
e1
|
e0
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
208
|
208
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.97 mm
|
1.97 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
PCM TRANSCEIVER
|
PCM TRANSCEIVER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
2
|
Package Equivalence Code |
|
BGA208,16X16,40
|
Peak Reflow Temperature (Cel) |
|
225
|
Supply Current-Max |
|
0.73 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare IDT82V2088BBG with alternatives
Compare IDT82V2088BB with alternatives