IDT82V1054APF8
vs
TLV320AIC1103GQE
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
TQFP-64
|
VFBGA, BGA80,9X9,20
|
| Pin Count |
64
|
80
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Companding Law |
A/MU-LAW
|
A/MU-LAW
|
| Filter |
YES
|
YES
|
| Gain Tolerance-Max |
0.25 dB
|
1 dB
|
| JESD-30 Code |
S-PQFP-G64
|
S-PBGA-B80
|
| JESD-609 Code |
e0
|
|
| Length |
10 mm
|
5 mm
|
| Linear Coding |
16-BIT
|
15-BIT
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
80
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
VFBGA
|
| Package Equivalence Code |
QFP64,.66SQ,32
|
BGA80,9X9,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1 mm
|
| Supply Voltage-Nom |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
10 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
| Supply Current-Max |
|
0.007 mA
|
| Technology |
|
CMOS
|
|
|
|
Compare IDT82V1054APF8 with alternatives
Compare TLV320AIC1103GQE with alternatives